INFINEON CHIP BUMP PDF

Infineon Chip Card & Security ICs Portfolio Infineon is the leading provider of security solutions and offers tailored and ready to Wafer sawn, NiAu-bump. Bernd Ebersberger. Infineon Technologies AG, D Muenchen, Germany We found that flip chip assembly with Cu pillar bumps is a robust process with. G. Chip on Board. COF/COG. Bump characteristics. Ball dropping . Several players, such as Freescale with RCP, Infineon with eWLB, and.

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Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then.

Supply imbalances reached a boiling point in the third and fourth quarters of this year, and it now appears that packaging customers may encounter select shortages well into There are several reasons for this. IC demand was greater than expected inso customers required more IC packaging capacity. But packaging houses are running at full capacity, unable to meet the demand for many but not all package types.

Besides IC packages, other types of products are also bimp short supply in what some call ijfineon boom or super cycle in the electronics sector. Even on the equipment side, such as chip bonders, we are having delivery issues. So in this round, not only is the supply constrained, but the demand is strong for a long sustainable time. Most component shortage situations are simple by comparison. And in DRAMssuppliers have been reluctant to add capacity despite rising demand.

The issues within IC packaging are more complex and involve several markets. Here are the bigger issues in the arena:.

In wafer bumping, solder balls or copper pillars are formed on a wafer, which provide the electrical interconnects between a die and a substrate. And then, demand for packaging equipment is stronger than expected. Not every package type is in short supply.

But in general, demand has been robust for OSATs throughout and heading into But needless to say, shortages impact the delivery schedules for packaging customers. These trends are worrisome for customers.

To help the industry gain an insight into the business, Semiconductor Engineering has taken a look at the main shortage issues in the sector, such as bumping capacity, package types, leadframes and equipment. Bumping shortages The current boom cycle took the industry by surprise in The IC packaging supply chain reflects the demand picture in the chip industry.

In the current cycle, packaging houses saw the traditional growth patterns in the first half of But in the third and fourth quarters of this year, OSATs began to see greater than expected demand in several segments. Automotive and networking are some new areas of demand that we are seeing now.

The demand caused a spike in orders at the OSATs. Offered as part of a turnkey service, wafer bumping is conducted on mm or mm wafers. Flip-chip is an interconnect scheme rather than a type of packaging.

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Flip-chip is used for application processors, graphics chips and microprocessors. In flip chip, tiny bumps or copper pillars are formed on a die. The device is flipped and mounted on a separate die or board. The die or board consists of copper pads. The bumps or pillars land on the copper pads, forming an electrical connection. Regardless, OSATs have enough mm bumping capacity in place.

Surprisingly, though, there is an acute shortage of more mature mm bumping capacity in the market.

Shortages Hit Packaging Biz

There are several reasons infinen this shortfall. For some time, the IC industry has seen an enormous demand for chips made on mm wafers, causing an acute shortage of mm fab capacity. The explosion of mm business has trickled down the supply chain and impacted the OSATs. But the shortfall in mm bumping capacity is mainly due to enormous demand from the analog and RF communities.

In fact, the mm bumping shortfall is causing a tight supply, if not shortages, for CSPs and RF front-end modules. Chhip front-end modules consist of the key RF components used in mobile phones. Previously, in packaging, these vendors have used a traditional technology called ball drop.

All of a sudden, they need a smaller bump. This enables bumps with smaller pitches, but it requires more process steps such as electroplating. Plating is a deposition step that infjneon the copper metallization schemes in IC packages.

So, the capacity challenges are happening because there is a transition from ball drop to plated bump. Going forward, mm bumping capacity is expected to be in short supply for some time.

OSATs have been reluctant to add mm capacity in the past, but some are changing course and plan to add more production in Other packaging types are also in high demand.

Insights From Leading Edge

Demand is strong for WLP, such as fan-in and fan-out. This is starting to soften a little, but will peak again in That will be challenging.

Next-generation, high-density fan-out packages also are ramping up. And surprisingly, QFN—an older but reliable package type—is also hot. A leadframe is a metal frame that consists of package leads and the frame. A die is attached to the frame. The leads are connected to the die using thin wires.

At the same time, Samsung is also jumping on QFN for its latest smartphones, according to multiple sources. But after various issues with its last smartphones, the company has reversed course and is now using more QFNs than WLPs in an effort to ensure the reliability of its phones, analysts said.

In contrast, Apple is using more WLPs in its latest smartphones, including both fan-in and fan-out packages.

Demand for QFN, meanwhile, is impacting the supply of components used to make these packages, namely leadframes. Leadframes using particular roughening treatments have suffered chi; lead times due to capacity shortages. Other leadframe suppliers have pushed out lead times due to copper raw material shortages. Infimeon examples L-Rprecision stamping, quality plating, photo etching.

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Leadframe woes To be sure, the leadframe business is undergoing some changes. The leadframe business is a low-margin segment that is going through some turbulent times. Here infinen just some of the recent events in the industry:.

Another Taiwan supplier, Jih Lin, bought the power semi leadframe unit from Sumitomo. All told, leadframe vendors and their customers face some challenges. Leadframe suppliers require a large amount of copper alloy material to make leadframes for IC packages.

With those issues in mind, suppliers of leadframes have been under stress in At about that time, copper suppliers began to shift more of their production from leadframes to connectors, causing lead times to stretch out. Traditionally, leadframe lead times are three to four weeks. Some were inifneon weeks. Now, we are back to 6 or 8 week levels. Some are 4 to 6 weeks.

Semiconductor Engineering Shortages Hit Packaging Biz

Right now, the leadframe market is a mixed bag. The bigger problem, according to Cheng and others, is the supply of copper alloy.

In fact, the lead times for copper alloy from suppliers are 40 to 50 days for leadframe customers and 30 to 40 days for connector vendors, according to SEMI. In the meantime, suppliers also increased the price.

China also produces copper alloy. While Chinese suppliers have ample capacity, the quality is sometimes sub-standard. Equipment outlook Besides certain package types and leadframes, OSATs also worry about the delivery times of the equipment used to make IC packages.

The lead times for some equipment are stretching out, while others are normal or within reason. Lead times for sputtering equipment and other systems are stretching out, however. Still, the question is clear—How will play out? For now, vendors are taking a wait and see approach. Then, we will wait for the next move. Great article with good points.

However, you might not be aware there is mm wafer bumping capacity available in the US from International Micro Industries, Inc. This name will be displayed publicly. This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded. Experts at the Table, Part 1: Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.

Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful. Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools. Access to source code makes it attractive for custom applications, but gaps remain in the tool flow and in software. Unexpected spike in IC demand is spilling over into the packaging supply chain.

Here are the bigger issues in the arena: